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Fine pitch interconnect rework for lead-free flip chip packages (PDF, 1.5 MB)

Ga liquid metal embrittlement for fine pitch interconnect rework (PDF, 2.3 MB)

Novel, high-throughput, fiber-to-chip assembly employing only off-the-shelf components (PDF, 1.5 MB)

Optoelectronic chip assembly process of optical MCM (PDF, 2 MB)

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