Technical flyers and white papers
Technical flyers
Advanced packaging (PDF, 795 KB)
High density interconnect packaging (PDF, 805 KB)
IBM packaging and test services (PDF, 1 MB)
Nanophotonics (PDF, 1.1 MB)
Semiconductor IC test services (PDF, 1 MB)
White papers
Study of capillary underfill filler separation in advanced flip chip packages (PDF, 445 KB)
Smart Packaging: A micro-sensor array integrated to an F/C (PDF, 790 KB)
Electrically testing non-underfilled flip chip assemblies-impacts on interconnect integrity (PDF, 815 KB)
Fine pitch interconnect rework for lead-free flip chip packages (PDF, 1.5 MB)
Ga liquid metal embrittlement for fine pitch interconnect rework (PDF, 2.3 MB)
Novel, high-throughput, fiber-to-chip assembly employing only off-the-shelf components (PDF, 1.5 MB)
Optoelectronic chip assembly process of optical MCM (PDF, 2 MB)
Thermo-compression bonding and mass reflow assembly processes of 3D logic die stacks (PDF, 1.4 MB)
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