What is IBM Assembly and Test Services?

Whether you are creating new semiconductor designs, developing inventive ways to maximize performance beyond silicon scaling, or coding new apps on IBM platforms, IBM® Assembly and Test Services teams can help you meet your goals. With extensive experience in bringing both complex and high-volume packaging solutions to the marketplace, the IBM Assembly and Test Services offerings help customers quickly ramp sophisticated solutions to production volumes.  

Our services

Advanced packaging solutions

We specialize in both large area and high-complexity packaging optimized to deliver differentiation and performance, supporting semiconductor fabless, integrated device manufacturers (IDMs), as well as original equipment manufacturers (OEMs).

Semiconductor test services

From chip design through production, IBM provides you with optimized approaches to test strategy, methodology, and final test plans.

Mechanical, electrical and thermal modeling and simulation

Data from our algorithms, codes, and library of materials properties and manufacturing tolerances provide excellent model-to-hardware correlation.

Technical resources and events

We have a range of technical resources and upcoming events that may be of interest to you.  Check out the PDFs below for more information on: