EUV patterning yield breakthrough sets new benchmark for logic scaling

IBM and New York State have upgraded their workhorse lithography tool with the latest EUV system, the NXE3400. Now, this system is fully operational in a state-of-the-art semiconductor research fab on the SUNY Poly campus in Albany, enabling logic research for the next decade to come.

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Extreme ultraviolet (EUV) lithography is finally here. How far will it go?

In late 2017, IBM successfully launched the next era of high-performance cognitive and AI hardware with the deployment of its POWER9 technology in the Summit and Sierra supercomputers, the most powerful supercomputers in the world to date.  Not to be outdone, IBM also launched the next era of constant-encryption mainframes, with the popular release of […]

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Advancing toward 7nm

This is the fourth of a four-part series about IBM featured papers at IEDM 2016. The annual International Electron Devices Meeting is “the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling.” So IBM researchers brought their scanning probe thermometer, their air spacer for […]

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