Nelson Felix, Senior Manager - Patterning & Metrology Research, IBM Research

EUV patterning yield breakthrough sets new benchmark for logic scaling

IBM and New York State have upgraded their workhorse lithography tool with the latest EUV system, the NXE3400. Now, this system is fully operational in a state-of-the-art semiconductor research fab on the SUNY Poly campus in Albany, enabling logic research for the next decade to come.

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IBM Research at SPIE 2020: New Architectures and Fabrications for AI Hardware

IBM Research had 21 papers accepted to SPIE, and throughout the four-day conference IBM researchers will present on topics ranging from EUV lithography, patterning materials, etch, selective deposition, and novel device integration.

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