Subscribe to this APAR
By subscribing, you receive periodic emails alerting you to the status of the APAR, along with a link to the fix after it becomes available. You can track this item individually or track all items by product.
APAR (Authorized Program Analysis Report) |
Abstract
LIC-COMM-SSL SYSTEM TLS OCSP STAPLING SUPPORT
Error Description
IBM i System Transport Layer Security has been enhanced to keep
up with the emerging industry standard for TLSv1.3 and to
enhance the support for TLSv1.2.
The native IBM i JSSE provider has been enhanced to include
support for Transport Layer Security version 1.3 (TLSv1.3)
protocol.
TLSv1.3 has been enhanced to support elliptic curve
Diffie-Hellman key exchange using Curve25519(x25519) and
Curve448(448)
TLSv1.2 has been enhanced to support ChaCha20 Poly1305 cipher
suites.
Online Certificate Status Protocol (OCSP) stapling support has
been added to TLSv1.3 and TLSv1.2
RSASSA-PSS certificate type has been added to TLSv1.3
Problem Summary
Please see the ERROR DESCRIPTION section.
Problem Conclusion
System TLS has OCSP stapling support now, and can be enabled
using the GSKit APIs or on application definitions using Digital
Certificate Manager.
Temporary Fix
Comments
Circumvention
PTFs Available
R740 MF66739 0121
Affected Modules
Affected Publications
Summary Information
Status............................................ | CLOSED PER |
HIPER........................................... | No |
Component.................................. | 9400DG300 |
Failing Module.......................... | RCHMGR |
Reported Release................... | R740 |
Duplicate Of.............................. |
IBM i Support
IBM disclaims all warranties, whether express or implied, including, but not limited to, the implied warranties of merchantability and fitness for a particular purpose. By furnishing this document, IBM grants no licenses to any related patents or copyrights. Copyright © 1996,1997,1998, 1999, 2000, 2001, 2002, 2003, 2004, 2005, 2006, 2007, 2008, 2009, 2010, 2011, 2012, 2013, 2014, 2015, 2016, 2017, 2018, 2019, 2020 IBM Corporation. Any trademarks and product or brand names referenced in this document are the property of their respective owners. Consult the Terms of use link for trademark information
Document Information
Modified date:
15 May 2020