Powering the future of AI infrastructure through advanced packaging
From chiplet integration and co-packaged optics to wafer-scale systems, IBM is delivering the advanced packaging technologies that enable the next generation of AI, high-performance computing, networking, aerospace, and mission-critical systems.
Advanced packaging has become the foundation for modern computing. As AI models grow larger and system performance demands increase, success depends on more than silicon alone. IBM combines decades of packaging innovation, manufacturing expertise, and advanced assembly technologies to deliver scalable solutions that push the boundaries of performance, bandwidth, power efficiency, and reliability.
IBM Bromont: More than 50 years of advanced packaging leadership
Located in Québec, Canada, IBM Bromont is one of North America's premier semiconductor packaging and test facilities. Since 1972, Bromont has developed and manufactured advanced packaging solutions for enterprise computing, AI, networking, aerospace, defense, healthcare and other demanding industries.
With over 850,000 square feet of manufacturing space, Bromont combines advanced assembly, test, characterization, package design and optoelectronic integration capabilities within a highly automated production environment. The site serves both IBM products and a growing ecosystem of external technology partners.
Bromont is uniquely positioned to bridge innovation and production, with development activities supported through its partnership with C2MI and IBM's broader research ecosystem.
No single packaging architecture can satisfy all AI infrastructure requirements. Future systems will rely on a combination of chiplet integration, optical interconnects, wafer-scale architectures and advanced manufacturing technologies. IBM's portfolio spans these critical domains, providing customers with scalable solutions from research through high-volume production.
Enabling the chiplet era
As AI and high-performance computing systems become increasingly complex, chiplet architectures require new approaches for connecting processors, memory and accelerators. IBM's MFIT™ technology provides a highly scalable platform for integrating multiple chips within a compact package while enabling exceptional performance and manufacturability.
Built around advanced organic redistribution layer interposers and embedded bridge technologies, MFIT™ supports high-density interconnects, improved signal integrity and efficient system scaling. The approach enables customers to achieve the benefits of advanced multichip integration while maintaining a practical path to high-volume manufacturing.
Designed for next-generation AI and HPC platforms, MFIT™ provides the flexibility required to bring together diverse silicon technologies into a single high-performance package.
2µm/2µm Routing | Embedded Bridges | Chiplet Integration | Panel-Scale Roadmap
Rethinking data movement
AI infrastructure is driving unprecedented bandwidth requirements. Moving data efficiently is becoming as important as processing it. IBM's co-packaged optics (CPO) solutions bring optical connectivity closer to compute, reducing latency, increasing bandwidth and improving overall system efficiency.
IBM combines years of optoelectronic packaging expertise with advanced assembly technologies to support high-density optical integration for next-generation AI and hyperscale data centers. These solutions are designed to enable both scale-up and scale-out architectures while addressing the growing power challenges of traditional electrical interconnects.
Through its lab-to-fab ecosystem, IBM supports customers from development through production, helping accelerate deployment of future optical infrastructure.
9+ Years Experience | 25+ Patents | HVM Ready | Optical AI Fabrics
Expanding the limits of compute
IBM's wafer-scale integration (WSI) platform represents a fundamentally different approach to system design. Rather than assembling multiple packaged devices together, WSI enables entire wafers to operate as highly integrated computing systems.
The result is unprecedented bandwidth, exceptional power efficiency and the ability to support massive AI and high-performance computing workloads. IBM's architecture combines advanced interconnects, vertical power delivery, integrated memory solutions and innovative cooling technologies into a single wafer-scale platform.
With years of development experience and demonstrated operational systems, IBM continues to advance WSI as a key technology for future AI infrastructure.
300mm Wafer Platform | 20kW Power Delivery | 50kW+ Cooling | HBM Integration
Built for today's most demanding systems
While IBM continues to pioneer future packaging technologies, it remains a leader in proven high-volume manufacturing platforms such as flip-chip BGA (fcBGA) and system-in-package (SiP). These technologies support a broad range of applications requiring high performance, reliability, thermal capability and complex multichip integration.
IBM's advanced fcBGA and SiP solutions are deployed across enterprise computing, networking, communications and specialized applications. The company's experience with large body sizes, dense interconnects and high-power designs enables customers to bring sophisticated products to market with confidence.
Backed by decades of manufacturing expertise, IBM continues to evolve these established packaging platforms to meet modern system requirements.
120mm Substrates | 10µm/10µm Routing | >400A Current | >400W Thermal Support
From Design to Production: Complete Advanced Packaging Services
IBM offers a comprehensive suite of services that support customers throughout the entire product lifecycle. From early architecture and package design through manufacturing, test, qualification, and production ramp, IBM provides the expertise needed to accelerate development and reduce risk.
IBM’s multidisciplinary teams work closely with customers to transform concepts into production-ready solutions while leveraging expertise from Bromont and IBM’s global research network.
Deploy. Co-Develop. Transform.
Every customer has a different path to innovation. IBM offers flexible engagement models that support immediate production needs while enabling future technology development.
Whether deploying a mature manufacturing solution, co-developing a new advanced package, or exploring disruptive next-generation architectures, IBM provides the technology, ecosystem, and manufacturing capabilities necessary for success.
Supported by a resilient on-shore supply chain strategy and a world-class research network, IBM helps customers move from concept to production with confidence.
