IBM Assembly and Test is a world leader in semiconductor packaging technology, products and services. Located in Bromont, Canada, with an 850,000 sq. ft manufacturing facility next to a 161,000 sq. ft development facility (C2MI), it is the largest manufacturing site in North America and offers advanced flip chip assembly and test.
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Whether you’re creating new semiconductor designs, developing inventive ways to maximize performance beyond silicon scaling or coding new apps on IBM platforms, IBM® Assembly and Test Services teams offer performance advantages, rapid time-to-market and differentiated solutions with personalized support.
Services include a certified engineering and manufacturing staff (all shifts); manufacturing floor badge reader controls; tracking controls, secure cabinets, pass and reject component traceability; traceability of die, wafers, modules and carcasses from reception to shipment; all ITAR controls plus a team to address special requirements.
We offer turnkey solutions—from modelling and simulation to materials and process characterization as well as optimized substrate design, a broad range of burn-in and test competencies and skillful failure analysis—in addition to providing personalized, expert support for differentiated solutions.
IBM Bromont is a world leader in semiconductor packaging technology, products and services. Now available to customers worldwide, we invite you to take advantage of our experience, system level mindset, and skilled engineers to execute your most advanced packaging and test solutions.
IBM researchers have been looking for what comes after copper.
IBM Research and Tokyo Electron have partnered on chipmaking innovation.
Specialized silicon to deliver their differentiated value in performance, scalability, reliability, availability, and serviceability.
We specialize in both large area and high-complexity packaging, optimized to deliver differentiation and performance, supporting semiconductor fabless, integrated device manufacturers (IDMs) and original equipment manufacturers (OEMs).
From chip design through production, our methods for implementing Design for Test (DFT) and Design for Manufacturing (DFM) promote process flow efficiencies, high productivity and accelerated time-to-market.
Get your final design on the first try. Our extensive data provides excellent model-to-hardware correlation, and broad-based analysis includes active and passive components, package, socket, PCB, connector and cabling to optimize the process.
IBM laboratory services showcase technical know-how derived from decades of experience supporting development and manufacturing of high value products. Your right-the-first-time package design begins with our material characterization and package modeling.
Adjacent to IBM Bromont is C2MI, the largest development center for assembly and test available on the open market in North America, dedicated to the development and prototyping of electronic and opto electronic modules.
The expansive size of the IBM Bromont OSAT allows us to make use of existing available floor space and increase both assembly and test capacity of fcBGA. Ready for qualification now, capacity and production will ramp up in 2024.
A collaboration with C2MI and neighboring partners will create an R&D and manufacturing facility exceeding the capabilities and capacity of those in Asia, resulting in a complete North American supply chain solution for complex, high-end configurations.
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