IBM assembly and test services
IBM Bromont is the largest OSAT in North America and uses unrivaled technology services to make your business move forward
Quantum System One now at IBM Bromont Chiplets with hybrid bonding
Person working with chip manufacturing

IBM Assembly and Test is a world leader in semiconductor packaging technology, products and services. Located in Bromont, Canada, with an 850,000 sq. ft manufacturing facility next to a 161,000 sq. ft development facility (C2MI), it is the largest manufacturing site in North America and offers advanced flip chip assembly and test.

  • Substrate design and modeling capabilities available
  • Automated photonics assembly line
  • Co-package in optics assembly and test is offered and an ADK is available
  • Design ground rules supporting very high current and high-power applications
  • Test services include wafer, module, and system level test as well as on-line test
  • Test equipment covers burn-in, wafer probe and package test
  • Test capabilities include logic, SRAM, analog, mixed-signal, RF and silicon photonic options
  • Able to handle ITAR and Trusted products for A&D market and listed as a Trusted Foundry

Read about the Quebec-IBM Discovery Accelerator

Benefits North America facility

Whether you’re creating new semiconductor designs, developing inventive ways to maximize performance beyond silicon scaling or coding new apps on IBM platforms, IBM® Assembly and Test Services teams offer performance advantages, rapid time-to-market and differentiated solutions with personalized support.

IP protection & ITAR compliance

Services include a certified engineering and manufacturing staff (all shifts); manufacturing floor badge reader controls; tracking controls, secure cabinets, pass and reject component traceability; traceability of die, wafers, modules and carcasses from reception to shipment; all ITAR controls plus a team to address special requirements.

Full development and production ecosystem

We offer turnkey solutions—from modelling and simulation to materials and process characterization as well as optimized substrate design, a broad range of burn-in and test competencies and skillful failure analysis—in addition to providing personalized, expert support for differentiated solutions.

Highly skilled team with deep expertise

IBM Bromont is a world leader in semiconductor packaging technology, products and services. Now available to customers worldwide, we invite you to take advantage of our experience, system level mindset, and skilled engineers to execute your most advanced packaging and test solutions.


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IBM Quantum System One Quantum Computer in Bromont Read the announcement
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Capabilities Advanced packaging solutions

We specialize in both large area and high-complexity packaging, optimized to deliver differentiation and performance, supporting semiconductor fabless, integrated device manufacturers (IDMs) and original equipment manufacturers (OEMs).

Semiconductor test services

From chip design through production, our methods for implementing Design for Test (DFT) and Design for Manufacturing (DFM) promote process flow efficiencies, high productivity and accelerated time-to-market.

Mechanical, electrical and thermal modeling and simulation

Get your final design on the first try. Our extensive data provides excellent model-to-hardware correlation, and broad-based analysis includes active and passive components, package, socket, PCB, connector and cabling to optimize the process.

Analytical services, reliability and failure analysis

IBM laboratory services showcase technical know-how derived from decades of experience supporting development and manufacturing of high value products. Your right-the-first-time package design begins with our material characterization and package modeling.

Research at MiQro Innovation Collaborative Center (C2MI)

Adjacent to IBM Bromont is C2MI, the largest development center for assembly and test available on the open market in North America, dedicated to the development and prototyping of electronic and opto electronic modules.

Learn more about C2MI
Upcoming expansions Phase 1:  Adding assembly and test capacity

The expansive size of the IBM Bromont OSAT allows us to make use of existing available floor space and increase both assembly and test capacity of fcBGA. Ready for qualification now, capacity and production will ramp up in 2024.

Phase 2: Wafer bumping and finishing for advanced packaging

A collaboration with C2MI and neighboring partners will create an R&D and manufacturing facility exceeding the capabilities and capacity of those in Asia, resulting in a complete North American supply chain solution for complex, high-end configurations.

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