Product Documentation
Abstract
Processor and heat sink removal and installation movie for the IBM eServer xSeries 235
Content
Text description of processor DIMM installation
Open the cover on the air baffle assembly. Locate the second processor socket (CPU-2 on the system board). Remove the processor air baffle and protective film (not shown). Open the processor release lever. Position and align the triangle on the processor with the triangle on the socket, then carefully seat the processor and close the release lever to secure.
Text description of heat sink installation
First remove the protective film from the bottom of the heat sink. Note: Do not touch the thermal grease on the bottom of the heat sink. Touching the thermal grease will contaminate it. Align and position the heat sink on top of the processor. Press firmly on the heat sink and then tighten the two captive screws. Alternate tightening the two captive screws until they are fully seated. Close the cover on the air baffle assembly.
Document Location
Worldwide
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Document Information
Modified date:
24 January 2019
UID
ibm1MIGR-52001