Replacing the system backplane in the 8348-21C

Learn how to replace the system backplane in the IBM® Power® System S812LC (8348-21C) system.

1. Ensure that you have the electrostatic discharge (ESD) wrist strap attached. If not, attach it now.
2. Remove the replacement system backplane from the static-protective package and place it on an ESD mat.

The following steps move the system processor module from the old system backplane to the new system backplane:

3. Remove the heat sink from the system processor module:
   1. A hex key wrench is attached to the rear of the chassis. Use that hex key wrench to loosen the heat sink actuation screw (A) by turning the screw counterclockwise. Loosen the screw until it moves freely. See Figure 1.
   2. Grip the heat sink (B) on opposing sides and remove the heat sink by lifting it upward. Set the heat sink aside with the module side facing up.
      Note: If you plan to remove dust or debris from the heat sink, you must do this operation in another room that is greater than 7.6 m (24.9 ft) away from the work area.
   Figure 1. Removing the heat sink

   
4. Remove dust and debris from the system processor module area.
   1. If dust or debris is present, use the supplied air pump (part number 45D2645) to clean the system processor module area. Blow small bursts of air from the center toward the sides of the system processor module as shown in Figure 2. If your air pump is not assembled as shown in Figure 2, fasten the tip onto the bulb.
      Figure 2. Removing dust and debris from the system processor module area

      
5. On the new system backplane, remove the socket cover from a system processor socket.
6. Prepare the system processor module for removal.
   1. Using the supplied removal tool (part number 01AF101), align the beveled corner (A) of the tool over the beveled corner of the system processor module as shown in Figure 3.
   2. Lower the tool over the system processor module by ensuring that the two guide pins (C) are inserted into the alignment holes (B) on each side of the tool.
      Figure 3. Lowering the removal tool onto the system processor module

      
   3. With the removal tool (A) sitting on top of the system processor module, push down on the tool to lock the system processor module into the tool, as shown in Figure 4. Ensure that both of the tool jaws are locked on the system processor module. Do not press the blue release tabs until directed to do so later.
      Note: The tool drops slightly when you push down on the processor module so that the jaws can grab the bottom of the module.
      Figure 4. Locking the system processor module into the tool

      
7. Holding the outside of the tool, lift the tool and system processor module from the old system backplane socket to transfer it to the new system backplane socket.
8. Install the system processor module:
   1. If dust or debris is present on the system processor socket, use the supplied air pump (part number 45D2645) to clean the socket. Blow small bursts of air from the center toward the sides of the socket, as shown Figure 5.
      Figure 5. Removing dust and debris from the system processor socket

      
   2. Lower the tool and system processor module onto the socket. Align the beveled corner (A) of the tool with the beveled corner on the socket. Ensure that the two guide pins (C) are inserted into the alignment holes (B) on each side of the tool. Use care to lower the tool evenly without tilting the tool. See Figure 6.
      Note: Do not attempt to slide the tool and the system processor module in any direction while the system processor module is touching the socket. If the tool and the system processor module are not aligned with the guide pins, lift the tool and the system processor module and reposition them.
      Figure 6. Installing the system processor module

      
   3. After the tool and system processor module holes and guide pins are properly aligned, squeeze and hold the two blue release tabs (A) together until a firm stop is reached, as shown in Figure 7. Then, lift the tool off the system processor module.
      Figure 7. Removing the system processor module tool

      
9. Inspect the thermal interface material (TIM) for visible signs of damage, as shown in Figure 8.

   The thermal interface material (TIM) is typically adhered to the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused. If the TIM is damaged, do not reuse the removed heat sink. Ensure that you have a spare TIM and heat sink on hand, part number 01AF286.

   Figure 8. Inspecting the thermal interface material

   
10. Are you replacing the TIM or heat sink?

    Yes:

    Continue with step 11.

    No:

    Go to step 12.

11. Install a new TIM pad:
    1. If the TIM or heat sink must be replaced, order part number 01AF286, heat sink and TIM.
    2. Open the TIM packaging and carefully remove the TIM, holding it by the edges of the carrier strip and holding it away from the shipping container.
    3. Remove the protective film from the clear carrier strip by using the supplied tweezers.
       Note: The TIM must remain flat. Small wrinkles are acceptable, but folds are not acceptable.
    4. Using the tweezers, remove the TIM from the carrier strip and center it onto the system processor module. The side with the red stripe must be facing up. Align the beveled edges of the TIM and the system processor module (A), as shown in Figure 9.
       Figure 9. Installing the TIM onto the processor lid

       
12. Install the heat sink:
    1. Position the heat sink by using the guide holes on the heat sink (A) to correctly align it with the guide pins (B). See Figure 10.
    2. Ensure that the heat sink load arms are engaged.
       Figure 10. Installing the heat sink

       
    3. A hex key wrench is attached to the rear of the chassis. Use that hex key to tighten the center load screw (B) clockwise until a firm stop is reached. If the heat sink moves noticeably, the load arms (A) are not engaged. Unscrew the center load screw and repeat this step again. See Figure 11.
       Figure 11. Tightening the center load screw on the heat sink

       

The following steps continue installing components into the new system backplane:

13. Moving the front cables out of the way, and carefully holding the processor heat sink, lower the system backplane into the chassis, sliding it towards rear of the chassis. See Figure 12.
    Figure 12. Replacing the system backplane

    
14. Align and screw the 13 screws into the system backplane. The screw locations are shown in Figure 13.
    Figure 13. System backplane screw locations

    
15. Replace the power distribution board and cables. See Replacing the power distribution board and cables in the 8348-21C.
16. Using your labels, replace the memory DIMMs. For instructions, see Removing and replacing memory in the 8348-21C for the replacement steps.
17. Using your labels, replace the PCIe adapters. For instructions, see Replacing a PCIe adapter in the 8348-21C.
18. Replace the front panel control cable in the system backplane, as shown in Figure 14.
    Figure 14. Connecting the front panel control cable

    
19. Replace the inner drives power cable in the system backplane, as shown in Figure 15.
    Figure 15. Connecting the inner drives power cable

    
20. Replace the front drive power cable in the system backplane, as shown in Figure 16. Ensure that the cable latch clip snaps into place on the connector.
    Figure 16. Connecting the front drive power cable

    
21. Replace the storage mezzanine card and cable. For instructions, see Replacing the storage mezzanine card and cable in the 8348-21C.
22. Replace the rear drive tray assembly. For instructions, see Replacing the rear drive tray assembly in the 8348-21C.
23. Replace the processor baffle. For instructions, see Replacing the processor baffle in an 8348-21C system.