Technical specifications

System Configurations

Model 8408-44E

Processor and Memory

Processor cores

48 at 3.65 GHz POWER8
40 at 3.95 GHz POWER8
32 at 4.22 GHz POWER8


2 - 4

Level 2 (L2) cache per core

512 KB

Level 3 (L3) cache per core

8 MB eDRAM shared L3

Level 4 (L4) cache

Up to 128 MB eDRAM L4 (off-chip) per socket

Enterprise Memory

Up to 32 CDIMMs
128 GB to 4 TB

Processor-to-Memory bandwidth

192 GBps per socket

Storage and IO

Integrated PCIe adapter slots

Up to 11 hot-swap PCIe Gen3 slots
x16: 4 - 8 (2 per socket)
x8: 3 (one defaults to 2 x 10 Gb LAN)

Integrated SAS Controllers

Two in storage backplane, supporting standard RAID 0,5,6,10, 5T2, 6T2 and 10T2

  • Dual SAS Controller Backplane, with 7.2 GB write cache
  • Dual SAS Controller Backplane, without write cache
  • Split Disk Backplane (two single SAS controllers), without write cache

Integrated SAS bays for solid-state drives (SSD) or hard-disk drives

8 hot-swap SFF SAS drive bays (2.5″) + 4 SSD bays (1.8″)

Expansion features (optional – operating system dependencies)

DVD bay


Max PCIe Gen3 I/O Drawers (12 PCIe Gen3 slots each)


Max DASD/SSD I/O Drawers (24 SFF bays each)

64 EXP24S I/O drawers

Standard features

Flexible Service Processor


IBM POWER Hypervisor™

LPAR, Dynamic LPAR; Virtual LAN (Memory to memory inter-partition communication)

PowerVM Enterprise Edition

20 Micro-Partitions per processor; Multiple Shared Processor Pools; Virtual I/O Server; Shared Dedicated Capacity; Live Partition Mobility (LPM) and Active Memory Sharing* (AMS)

RAS features

Processor Instruction Retry
Alternate Processor Recovery
Selective dynamic firmware updates
Chipkill memory
Memory DRAM sparing
Dynamic L3 cache column repair
Dynamic Processor de-allocation
Phase redundant, integrated sparing voltage regulator modules for processors, memory and I/O
Second generation service processor
Hot swappable Time-of-Day battery
Redundant, hot swappable power supplies
Redundant fans for SAS controllers and drive bays
Redundant, hot swappable fans for processor, memory and PCIe slots
Hot-swappable SAS bays
Hot-swappable PCIe slots
Dynamic de-allocation of logical partitions and PCIe bus slots
Extended error handling on PCIe slots
Active Memory Mirroring for Hypervisor (optional)

Capacity on Demand features (optional)

Processor and/or Memory Capacity Upgrade on Demand (CUoD)
Elastic Processor and/or Memory Capacity on Demand (CoD)
Trial Processor and/or Memory CoD
Utility CoD

Cloud Management and Deployment features

IBM Cloud PowerVC Manager
HMC Apps as a Service
IBM API Connect and WebSphere Connect
Open source cloud automation and configuration tooling for AIX
Power to Cloud Rewards – 5,000 points
IBM Cloud Starter Pack

Operating systems

AIX and Linux

High availability

Power HA Editions

Power requirements

Operating voltage: 200 to 240 V AC

System dimensions

Four EIA (4U) space in a 19-inch rack
Width: 449 mm (17.6 in.)
Depth: 776 mm (30.6 in.)
Height: 175 mm (6.9 in.)

* Operating system support required

† Clients purchasing a Power E850C system are eligible to receive 6 months of access, at no additional charge, to a POWER8 bare-metal server running Ubuntu Linux in SoftLayer's Dallas data center. Additional months are available for purchase.

‡ See Facts and Features for specific supported operating system levels