Today, many companies do not have in-house physical analysis and characterization capabilities for their electronic card assemblies. They must rely on the supplier of that assembly to find root cause of failures. This often results in misdiagnosis of failures, ineffective root cause identification and incorrect application of effective corrective actions.
IBM has the technical depth of industry recognized experts and state of the art failure analysis labs to quickly identify issues during advanced technology qualifications thru problems encountered with products failing in the field. These capabilities are complementary to supplier based quality and failure analysis and provides an independent and higher level analysis often required to resolve complex and multi-variable failures found in today's systems.