Who is Product Testing & Engineering Design Services?

Product Testing & Engineering Design Services (PTEDS) is made up of key IBM development organizations delivering leading-edge design, development, test and analytical services in mechanical packaging, power subsystems, acoustics, electromagnetic compatibility, product cooling and design.

These highly trained IBM teams of professionals, experienced in product development engineering, have qualified their state-of-the-art laboratories and personnel with the required product certification authorities in the United States, Europe, Pacific Rim and emerging global markets. IBM is unique in having the talent and resources to be able to provide a wide range of comprehensive design services to customers.

Our Services


Industry leading experts offer a wide variety of accredited acoustical test and design services to provide tailored solutions to meet the needs of the client.

Electromagnetic compatibility

Our prestigious, accredited electromagnetic test labs are operated by a highly qualified professional staff ready to assess the electromagnetic emissions and immunity for any product.

Electronic assembly failure analysis

Utilize the technical depth of industry recognized experts and state of the art failure analysis labs to quickly remedy issues encountered with electronic card assemblies. Experts provide characterization, physical analysis, and expert interpretations through out an assembly’s lifecycle.

Environmental, installation planning and safety technology

Experienced professionals in the fields of environmental, installation and product safety are proficient at designing for and attaining relevant certifications.

Industrial design and human factors

Highly skilled industrial design specialists have the expertise to create an iconic visual appearance balanced with optimal accessibility and usability for any set of product requirements


The highly experienced interconnect team is ready to design connector solutions to deliver power reliability and efficiently between the power subsystems in any electronic products.

Material selection and analysis

Experts in the field of material science offer a wide variety of services to analyze material performance to identify requirements and prescribe a complete solution.

Mechanical analysis and test

The mechanical analysis and test team provides advanced capability in structural integrity testing and finite element modeling.

Mechanical packaging and reliability engineering

The mechanical packaging and reliability engineering team is equipped with the latest Mechanical Design Automation (MDA) tools and vibration analysis capabilities to ensure a comprehensive packaging solution to meet our client’s needs.

Product cooling and thermal analysis

Highly skilled electronic cooling professionals are able to provide advanced thermal engineering solutions to satisfy our client’s product cooling requirements.

Product packaging engineering

Our team’s expertise in package design techniques testing, methodologies, and in-depth knowledge of global distribution networks provide valuable insight on how to design packaging and products to not only survive, but to efficiently navigate the hazardous global supply chain.

Project management

Project management skills required to manage integrated product design for very complex and industry leading computing hardware solutions are ready to help our clients manage the development process for design and test of their new products.

System power

With years of experience in architecting a wide range of power subsystems, our team is ready to provide a cost-effective power solution with the redundancy and reliability to meet the demands of the project.