What is IBM Assembly and Test Services?

Whether you are creating new semiconductor designs, developing inventive ways to maximize performance beyond silicon scaling, or coding new apps on IBM platforms, IBM® Assembly and Test Services teams can help you meet your goals.

We are creating advanced customized packaging product and services to allow you to get performance advantages and rapid time-to-market.


Advanced packaging solutions

We specialize in both large area and high-complexity packaging optimized to deliver differentiation and performance, supporting semiconductor fabless, integrated device manufacturers (IDMs), as well as original equipment manufacturers (OEMs).

Our mindset is one of quality, precision, and technical leadership while facilitating fast turnaround-time for both development and production.

Semiconductor test services

From chip design through production, IBM provides you with optimized approaches to test strategy, methodology, and final test plans.

The best methods for implementing design for Test (DFT) and Design for Manufacturing (DFM) promote process flow efficiencies, high productivity and accelerated time-to-market.

Mechanical, electrical and thermal modeling and simulation

Data from our algorithms, codes, and library of materials properties and manufacturing tolerances provide excellent model-to-hardware correlation.

Broad based analysis includes active and passive components, package, socket, PCB, connector and cabling to help increase the effectiveness of the process. All this to get your final design at the first try.

Analytical services, reliability and failure analysis

IBM laboratory services showcase technical know-how derived from decades of experience supporting development and manufacturing of high value products.

Your right-the-first-time package design begins with our material characterization and package modeling.

Research at MiQro Innovation Collaborative Center (C2MI)

C2MI facilitate microsystem design and prototyping in compliance with market needs in field of application such as communication technology, automobile, aerospace, environment and health, so as accelerate commercialization.