As part of the system processor module replacement, the heat sink is removed.
When the heat sink is removed from the system processor module, the thermal interface material (TIM)
is typically adhered to the heat sink. Unless damaged, the TIM that is adhered to the heat sink can
be reused. If the TIM is damaged, do not reuse the removed heat sink. Before you begin the processor
removal and replacement procedure, ensure that you have a spare TIM and heat sink on hand.
Procedure
Attach the electrostatic discharge (ESD) wrist strap.
The ESD wrist strap must be connected to an unpainted metal surface until the service
procedure is completed, and if applicable, until the service access cover is replaced.
Attention:
Attach an electrostatic discharge (ESD)
wrist strap to the front ESD jack, to the rear ESD jack, or to an unpainted metal surface of your
hardware to prevent the electrostatic discharge from damaging your hardware.
When you use an ESD wrist strap, follow all
electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or
decrease your risk of receiving electric shock when using or working on electrical
equipment.
If you do not have an ESD wrist strap, just prior
to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted
metal surface of the system for a minimum of 5 seconds. If at any point in
this service process you move away from the system, it is important to again discharge yourself by
touching an unpainted metal surface for at least 5 seconds before you continue with the service
process.
Open the packaging of the new system processor module, and place the cover upside down next to
the tray, as shown in the following figure. The cover is used for the system processor module that
you are replacing.
Figure 1. Opening the system processor module packaging
Lift the air baffle (A) straight up as shown in the
following figure.
Place the air baffle on a clean area.Figure 2. Removing the air baffle
Remove the heat sink from the system processor module:
Loosen the heat sink actuation screw by turning the supplied hex key counterclockwise
(A). Loosen the screw until it moves freely. See the following figure.
Hold the heat sink (B) on opposing sides and remove the heat sink by
lifting it upward. Set the heat sink aside with the module side face up.
Note: If you plan to
remove dust or debris from the heat sink, this operation must be completed in another room that is
greater than 7.6 m (24.9 ft) away from the work area.
Figure 3. Removing the heat sink
Using tweezers, carefully remove the TIM from the top of the system processor module and place
it in a clean, dry area as shown in the following figure.
The TIM can tear easily.Figure 4. Removing the TIM from the system processor module
Remove dust and debris from the system processor module area.
If dust or debris is present, use the supplied air pump to clean the system processor module
area. Blow small bursts of air from the center toward the sides of the system processor module as
shown in the following figure. If your air pump is not assembled as shown in the following figure,
fasten the tip onto the bulb. Figure 5. Removing dust and debris from the system processor module area
Prepare the system processor module for removal.
Open the latches that hold the system processor module in the supplied
removal tool (A). Push down on the ring (B) while
pressing in on the tabs (C).
See the following figure.Figure 6. Opening the processor removal tool latches
Lower the tool over the system processor module while ensuring that the two
guide pins (A) insert into the alignment holes (B) on
each side of the tool.
See the following figure.Figure 7. Lowering the removal tool onto the system processor module
With the removal tool on top of the system processor module, push down on
the ring (A) to close the latches (C) and lock the
system processor module into the tool. Make sure that both of the tool jaws are locked on the system
processor module.
See the following figure. Figure 8. Locking the system processor module into the tool
Holding the outside of the tool, lift the tool and system processor module from the socket.
Place them at an angle in the top cover of the system processor module packaging, as shown in the
following figure.
Note: Set the tool and system processor module at an angle on the top cover of the system processor
module packaging. That makes the module easier to pick up and place into the package.
Figure 9. Placing the tool at an angle on the top cover of the packaging
Open the latches that hold the system processor module in the supplied
removal tool (A). Push down on the ring (B) while
pressing in on the tabs (C).
See the following figure.Figure 10. Releasing the system processor module from the tool