Removing a system processor module from the 8001-22C or 8005-22N system

Learn how to remove a system processor module from the IBM® Power® System S822LC for Big Data (8001-22C) or the IBM CS822 (8005-22N) system.

Before you begin

Power off the system and place it in the service position. For instructions, see Preparing the 8001-22C or 8005-22N system to remove and replace internal parts.

About this task

As part of the system processor module replacement, the heat sink is removed. When the heat sink is removed from the system processor module, the thermal interface material (TIM) is typically adhered to the heat sink. Unless damaged, the TIM that is adhered to the heat sink can be reused. If the TIM is damaged, do not reuse the removed heat sink. Before you begin the processor removal and replacement procedure, ensure that you have a spare TIM and heat sink on hand.

Procedure

  1. Attach the electrostatic discharge (ESD) wrist strap.
    Attention:
    • Attach an electrostatic discharge (ESD) wrist strap to the front ESD jack, to the rear ESD jack, or to an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging your hardware.
    • When you use an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or decrease your risk of receiving electric shock when using or working on electrical equipment.
    • If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted metal surface of the system for a minimum of 5 seconds.
  2. Open the packaging of the new system processor module and place the cover upside down next to the tray, as shown in Figure 1. The cover is used for the system processor module that you are replacing.
    Figure 1. Opening the system processor module packaging
    Opening the system processor module packaging
  3. Remove the processor air baffle as shown in Figure 2. Carefully unsnap and lift the processor air baffle from the system.
    Figure 2. Removing the processor air baffle
    Removing the processor air baffle
  4. Loosen the load arm screw (A) of the system processor heat sink that you are removing by using a #3 Phillips screw driver as shown in Figure 3.
    Figure 3. Loosening the load arm screw of the heat sink
    Loosening the load arm screw of the heat sink
  5. Pivot and lift up on the heat sink. The load arm pivots up; pivot the heat sink and lift it from the load arm. See Figure 4.
    Figure 4. Lifting the heat sink from the load arm
    Lifting the heat sink from the load arm
  6. Place the heat sink upside down on a clean surface.
  7. Inspect the system processor socket area and remove any dust or debris (use a can of compressed air).
  8. Lower the vacuum pen tool onto the system processor module. Fully press the top of the pen (A) and hold the pen in the center of the processor module as shown in Figure 5. Release the top of the pen to fasten the pen onto the processor module.
    Note: To prevent the system processor module from falling, do not press the tip while holding the pen and the system processor module. Minimize the time and distance that you have the pen holding the system processor module in case the vacuum seal releases early.
    Figure 5. Locking the vacuum pen to the system processor module
    Locking the vacuum pen to the system processor module
  9. Holding the vacuum pen, lift the pen and system processor module from the socket. Place them at an angle on the top cover of the system processor module packaging as shown in Figure 6. Setting the system processor module at an angle on the top cover of the system processor module packaging will make it easier to pick up and place in the packaging after you replace the system processor module.
    Figure 6. Placing the processor at an angle on the top cover of the packaging
    Placing the processor at an angle on the top cover of the packaging
  10. Press the top of the pen to release the system processor module onto the cover.
    Figure 7. Releasing the pen
    Releasing the pen



Last updated: Tue, November 17, 2020