Removing the system processor module from the 7063-CR2 system

To remove the system processor module from the IBM® Power® Systems HMC (7063-CR2) system, complete the steps in this procedure.

About this task

(L007)

CAUTION:

A hot surface nearby. (L007)

1. Power off the system.
   For instructions, see Stopping the 7063-CR2 system.
2. Attach the electrostatic discharge (ESD) wrist strap.
   The ESD wrist strap must be connected to an unpainted metal surface until the service procedure is completed, and if applicable, until the service access cover is replaced.

   Attention:

   • Attach an electrostatic discharge (ESD) wrist strap to the front ESD jack, to the rear ESD jack, or to an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging your hardware.
   • When you use an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or decrease your risk of receiving electric shock when using or working on electrical equipment.
   • If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted metal surface of the system for a minimum of 5 seconds. If at any point in this service process you move away from the system, it is important to again discharge yourself by touching an unpainted metal surface for at least 5 seconds before you continue with the service process.
3. Remove the system backplane from the rear of the system.
   1. Label and remove the two power cables.
      For instructions, see Disconnecting the power cords from a 7063-CR2 system.
   2. Label and remove the signal cables from the rear of the system.
   3. Loosen the two screws (A) on the sides of the system backplane as shown in the following figure.

      

   4. Simultaneously rotate the two levers (A) on each side of the system backplane out and to the side to unlock the system backplane from the system.

      

   5. Support the system backplane by the bottom as you slide it from the system.

      

   6. Place the system backplane on an ESD surface.
   Note: You must remove and replace the system backplane at a flat angle. The ventilation holes in the top cover can come into contact with the DIMMs in the system backplane if the insertion of the backplane is at an angle or is rushed. As a result of possible contact, DIMMs can be scratched and can leave residue on the top cover.
4. Open the packaging of the new system processor module and place the cover upside down next to the tray, as shown in the following figure. The cover is used for the system processor module that you want to replace.

   

5. Loosen the load arm screw (A) of the system processor heat sink (B) that you are removing with a T20 hexalobular driver. The load arm pivots up in the direction that is shown in the following figure.

   

6. Grip the heat sink and remove it by lifting it straight up as shown in the following figure.

   

7. Place the heat sink upside down on a clean surface.
8. Using tweezers, carefully remove the TIM from the top of the system processor module and place it in a clean, dry area.
   The TIM can tear easily.
9. Inspect the system processor socket area and remove any dust or debris (use a can of compressed air).
10. Align the tool with the beveled edge (A) of the system processor module as shown in the following figure. Lower the tool over the system processor module by ensuring the two guide pins (C) are inserted into the alignment holes (B) on each side of the tool.

    

11. With the removal tool (A) sitting on top of the system processor module, push down on the tool to lock the system processor module into the tool as shown in the following figure.
    The tool drops slightly when you push down on the system processor module so that the jaws can grab the bottom of the module. Make sure that both of the tool jaws are locked on the system processor module. Do not press the blue release tabs until directed to do so later.

    

12. Hold the outside of the tool and lift the tool and system processor module from the socket. Place them at an angle on the top cover of the system processor module packaging as shown in the following figure.
    Setting the system processor module at an angle on the top cover of the system processor module packaging will make it easier to pick up and place in the packaging after you replace the system processor module.

    

13. Squeeze the two blue tabs to release the system processor module from the tool as shown in the following figure.