Replacing a system processor module in the 7063-CR1 system
Learn how to replace a system processor module in the IBM 7063-CR1 Hardware Management Console system.
Procedure
- Ensure that you have the electrostatic discharge (ESD) wrist strap on and that the ESD clip is plugged into a ground jack or connected to an unpainted metal surface. If not, do so now.
- Inspect the system processor socket area and remove any dust or debris (use a can of compressed air).
-
Lower the vacuum pen tool onto the system processor module to install. Fully press the top of
the pen (A) and hold the pen in the center of the system processor module as
shown in Figure 1. Release the top of the pen
to fasten the pen onto the system processor module.
Note: To prevent the system processor module from falling, do not press the tip while holding the pen and the system processor module. Minimize the time and distance that you have the pen holding the system processor module, in case the vacuum seal releases early.
Figure 1. Lowering the removal tool onto the system processor module 
-
Install the system processor module:
-
Lower the pen and system processor module onto the socket as shown in Figure 2. Align the beveled corner of the system processor
module with the beveled corner on the system processor socket.
Use care to lower the tool evenly without tilting the system processor module.Note: Do not attempt to slide the tool and the system processor module in any direction while the system processor module is touching the system processor socket.
Figure 2. Lowering the system processor module into the system processor socket 
- After the system processor module is properly aligned, press the top of the pen to release it from the system processor module. Lift the pen off the system processor module.
-
Lower the pen and system processor module onto the socket as shown in Figure 2. Align the beveled corner of the system processor
module with the beveled corner on the system processor socket.
-
Install the new supplied heat sink that is provided in the FRU kit. The TIM is pre-applied to
the heat sink. Carefully lower the heat sink over the system processor module, ensuring that the
holes in the heat sink (A) align with the two guide pins
(B) on the socket, as shown in Figure 3.
Figure 3. Installing the heat sink 
-
Move the load arm (A) into position over the heat sink
(B) and tighten the load arm screw with a #3 Phillips screw driver, as shown
in Figure 4.
Note: Do not overtighten the load arm screw.
Figure 4. Tightening the load arm screw 
-
Install the system processor air baffle as shown in Figure 5.
Insert the edge of the system processor air baffle into the fan support. Then, carefully press the system processor air baffle down into place.
Figure 5. Installing the system processor air baffle 
-
Lightly grip the system processor module that you replaced by the edges and lift it off the
shipping cover. Align the beveled corner of the module (A) to the corner of
the tray with the triangle (B) and place it in the tray, as shown in Figure 6.
Figure 6. Placing the system processor module into the shipping tray 
What to do next
Prepare the system for operation. For instructions, see Preparing the 7063-CR1 system for operation after removing and replacing internal parts.