Exchange the CEC enclosure system processor module

1. Use a replacement part with a valid DS8000® part number to ensure it has the proper firmware, VPD, and/or configuration to ensure it is compatible with the DS8000 service procedures. Attempting to use a generic server FRU might fail and require next level of support to recover.
2. All parts being removed must be marked or identified so they can be installed into their original locations.
   Note: Failure to mark or identify parts can extend the service duration and may require next level of support assistance.
3. Use the front and rear blue identify LEDs to determine the CEC enclosure to be repaired. Both blue LEDs should be lit.
   • CEC control panel blue identify LED as shown in Figure 1.
   • CEC enclosure rear blue identify LED as shown in Figure 2.

   Note: If both the front and rear CEC enclosure identify LEDs are not lit, use the location code listed in the serviceable event FRU list. See MAP1245 Finding FRUs by using location codes.

   

   

4. Verify that the CEC enclosure is in the power-off state. See Figure 3.
   1. At the rear of the CEC enclosure, view all CEC enclosure power supply DC LEDs.
   2. Are all DC (output) LEDs flashing?
      • Yes, continue with the next step.
      • No, do not continue with this FRU replacement. Go to MAP4841 CEC enclosure fails to power off during service processor repair (Models A0x).

   

5. Disconnect the power cords from the CEC with the DC (output) LEDs flashing. See Figure 4.
   Notes:

   • Ensure the power cords are correctly labeled.
   • The power supply LEDs might continue to flash for up to 20 seconds while internal power is discharged.
   • The power cord is fastened to the system using the hook-and-loop fastener . Unstrap the fastener to allow the enclosure to be placed in the service position.

   

6. Observe the CEC enclosure control panel green power button LED . See Figure 5.
   • If it is off, go to the next step.
   • If it is flashing, the CEC enclosure is still in the power-off state. DO NOT CONTINUE. Ensure that you have unplugged the power cables.

   

7. Attach the electrostatic discharge (ESD) wrist strap. The ESD wrist strap must be connected to an unpainted metal surface until the service procedure is completed, and if applicable, until the service access cover is replaced.
   Attention:

   • Attach an electrostatic discharge (ESD) wrist strap to the front ESD jack, to the rear ESD jack, or to an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging your hardware.
   • When you use an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or decrease your risk of receiving electric shock when using or working on electrical equipment.
   • If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted metal surface of the system for a minimum of 5 seconds. If at any point in this service process you move away from the system, it is important to again discharge yourself by touching an unpainted metal surface for at least 5 seconds before you continue with the service process.

   

8. Disconnect all remaining cables from the rear of the CEC enclosure. See Table 1 and Figure 7.

   Table 1. CEC enclosure cable connections

   Connection	Description
   P1-C1-T1 (HMC 1)	FSP Ethernet
   P1-C1-T2 (HMC 2)	FSP Ethernet
   P1-C2-T1	PCIe to I/O enclosures (if C2 present)
   P1-C3-T1, P1-C3-T2	PCIe to I/O enclosures (if C3 present)
   P1-C4-T1	PCIe to I/O enclosures (if C4 present)
   P1-C6-T1	PCIe to I/O enclosures
   P1-C8-T1	PCIe to I/O enclosures
   P1-C9-T1	PCIe to I/O enclosures
   P1-C10-T1, P1-C10-T2	Customer network (optional feature, if used)
   P1-C11-T1, P1-C11-T2	LPAR Ethernet
   P1-C12-T1	PCIe to I/O enclosures

   

9. Place the CEC enclosure into the service position.
   1. Open the side latches and pull the latches to slide the system unit fully into the service position, until the slides click and hold the system unit securely.
   2. Ensure that the screws inside the latches are not secured to the rack. See Figure 8.

   

10. Remove the service access cover.
    1. Ensure that you have the electrostatic discharge (ESD) wrist strap on and that the ESD clip is plugged into a ground jack or connected to an unpainted metal surface.
    2. Release the service cover latch by pushing the release latch in the direction shown.
    3. Slide the cover off the system unit. When the front of the service access cover clears the upper frame ledge, lift the cover up and off the system unit.
       Attention: For proper cooling and airflow, replace the cover before turning on the system.

    

11. Press and hold the push-button on the trusted platform module card to activate the identify LED for the faulty part as shown in Figure 10. Verify that the LED is lit, which indicates that sufficient power exists for the identify LED. If the LED is not lit, use the location code to find the physical location by using the service label.

    

To remove a system processor module, complete the steps in this procedure.

1. Ensure that you have the electrostatic discharge (ESD) wrist strap on and that the ESD clip is plugged into a ground jack or connected to an unpainted metal surface.
2. Open the packaging of the new system processor module, and place the cover upside down next to the tray, as shown in Figure 11. The cover is used for the system processor module that you are replacing.

   

3. Remove the heat sink from the system processor module.
   CAUTION:

   (L007) A hot surface nearby. 
   1. Loosen the heat sink actuation screw by turning the supplied hex key counterclockwise . Loosen the screw until it moves freely. See Figure 12.
   2. Grip the heat sink on opposing sides and remove the heat sink by lifting it upward. Set the heat sink aside with the module side facing upward.
      Note: If you plan to remove dust or debris from the heat sink, this operation must be performed in another room that is greater than 7.6 m (24.9 ft) away from the work area.

      

4. Using the supplied tweezers, remove the TIM from the top of the system processor module and place it in a clean, dry area as shown in Figure 13.
   Note: Be careful not to damage the TIM as it is very light and fragile.

   

5. Prepare the system processor module for removal:
   1. Ensure that the removal tool is in the open position as shown in Figure 14. The middle ring must be pushed down and blue tabs must be turned inward.

      

   2. Align the tool over the system processor module. Ensure that the beveled edge on the tool aligns with the beveled edge of the system processor module as shown in Figure 15.
   3. Lower the tool over the system processor module. Ensure that the two guide pins insert into the alignment holes on each side of the tool as shown in Figure 15.

      

   4. With the removal tool sitting on top of the system processor module, push down on the ring slightly so that the blue tabs snap outward and the jaws engage with the system processor module as shown in Figure 16. Make sure that both of the tool jaws are locked onto the system processor module by pushing down on the tool.
      Important: Do not press the blue release ring until directed to do so later.

      

6. Hold the outside of the tool and lift the tool and system processor module from the socket. Lift the tool upward slowly to ensure that the jaws are fully engaged with the system processor module. Ensure that the system processor module does not disengage and fall back into the socket of the system processor module. If the system processor module falls back into the socket of system processor module, the pins may be damaged. Place the system processor module at an angle on the top cover of the packaging as shown in Figure 17. Setting the tool and system processor module at an angle on the top cover of the system processor module packaging makes it easier to place the system processor module in the packaging.

   

7. Release the system processor module by pushing the ring downwards. Hold the ring down while pushing the blue tabs inward as shown in Figure 18. Ensure that the ring catches the openings on the blue tabs, and that the blue tabs are locked in a fixed position. To prevent the system processor module from falling, pull up on the round lever before you place the tool on the top cover of the system processor module packaging.

   

To replace a system processor module in the system, complete the steps in this procedure.

1. Ensure that you have the electrostatic discharge (ESD) wrist strap on and that the ESD clip is plugged into a ground jack or connected to an unpainted metal surface.
2. Prepare the system processor module for installation:
   1. Ensure that the removal tool is in the open position as shown in Figure 14. The middle ring must be pushed down and blue tabs must be turned inward.

      

   2. Lower the tool over the system processor module as shown in Figure 20. Ensure that the beveled edge on the tool aligns with the beveled edge of the system processor module. Ensure that the two guide pins are inserted into the alignment holes on each side of the tool.

      

   3. With the removal tool sitting on top of the system processor module, push down on the ring slightly so that the blue tabs snap outward and the jaws engage with the system processor module as shown in Figure 21. Make sure that both of the tool jaws are locked onto the system processor module by pushing down on the tool.
      Important: Do not press the blue release tabs until directed to do so later.

      

3. Install the system processor module:
   1. If dust or debris is present on the system processor socket, use the supplied air pump to clean the socket. Blow small bursts of air from the center toward the sides of the socket, as shown in Figure 22.

      

   2. Hold the sides of the tool with system processor module and carefully lift the tool out of the system processor module tray.
   3. Lower the tool and system processor module onto the socket. Align the beveled corner of the tool with the beveled corner on the socket. Align the guide pins with the alignment holes on each side of the tool. Use care to lower the tool evenly without tilting the tool. See Figure 23.
      Note: Do not attempt to slide the tool and the system processor module in any direction while the system processor module is touching the socket. If the tool and the system processor module are not aligned with the guide pins, lift the tool and the system processor module and reposition them.

      

   4. Open the latches that hold the system processor module in the supplied removal tool as shown in Figure 24. Push down on the ring while pressing in on the tabs .

      

   5. Lift the tool off the system processor module.
4. Inspect the thermal interface material (TIM) for visible signs of damage, as shown in Figure 25.

   

5. Choose one of the following repair options:
   • If the TIM is damaged, go to step 6 to replace the TIM and install the existing heat sink.
   • If the TIM is not damaged, it can be reused. Go to step 7 to move the TIM and install the existing heat sink.
6. Use this step to install a new TIM and reuse the existing heat sink.
   1. Open the TIM packaging and carefully remove the TIM, holding it by the edges of the carrier strip and holding it away from the shipping container.
   2. Remove the protective film from the clear carrier strip by using the supplied tweezers.
      Note: The TIM must remain flat. Small wrinkles are acceptable, but folds are not acceptable.
   3. Using the tweezers, remove the TIM from the carrier strip and center it onto the system processor module. The TIM has no preferred up-side. The TIM can be placed on the system processor module and centered as shown in Figure 26.

      

   4. Place the heat sink on the TIM as shown in Figure 27.

      

7. To reuse the existing undamaged TIM and heat sink:
   1. Using the tweezers, move the old processor's TIM from the clean, dry surface and center it onto the new system processor module. The TIM has no preferred up-side. The TIM can be placed on the system processor module and centered as shown in Figure 28.

      

   2. Place the heat sink on the TIM as shown in Figure 29.

      

8. Secure the TIM and heat sink to the socket of the system processor module.
   1. Ensure that the heat sink load arms are engaged as shown by in Figure 30.
   2. Tighten the center load screw clockwise by using the supplied hex key as shown by in Figure 30 until a firm stop is reached. If the heat sink moves noticeably, the load arms are not engaged. Unscrew the center load screw and repeat this step again.

   

9. Lightly grip the system processor module that you replaced by the edges and lift it off of the packaging cover. Align the beveled corner of the module to the corner of the packaging with triangle and place it in the packaging, as shown in Figure 31. Close the packaging cover.

   

1. Ensure that you have the electrostatic discharge (ESD) wrist strap on and that the ESD clip is plugged into a ground jack or connected to an unpainted metal surface.
2. Replace the service access cover. See Figure 32.
   1. Slide the cover onto the system unit.
   2. Close the latch release by pushing it in the direction shown.

   

3. Place the CEC enclosure into the operating position.
   1. Unlock the blue rail safety latches as shown in Figure 33 by pushing them inward.
   2. Push the system unit all the way into the rack until both release latches lock the system into the operation position.
   3. Secure the enclosure to the rack with screws, if screws were loosened when preparing the enclosure for service.

   

4. Attach the electrostatic discharge (ESD) wrist strap.
5. Reconnect all cables, except for power cords. See Table 2 and Figure 34.
   If optical Ethernet connections are used, use proper cleaning procedures.

   Important: The optical cable plugs (LC connectors) and ports (SFPs) must be cleaned before connecting them. Use cleaning tool 54Y4392 or IBM-approved alternative. After cleaning SFPs with the tool, use air bulb 45D2645 or IBM-approved alternative. For detailed procedures, refer to current DS8000 Info Alerts or contact your next level of support.

   Table 2. CEC enclosure cable connections

   Connection	Description
   P1-C1-T1 (HMC 1)	FSP Ethernet
   P1-C1-T2 (HMC 2)	FSP Ethernet
   P1-C2-T1	PCIe to I/O enclosures (if C2 present)
   P1-C3-T1, P1-C3-T2	PCIe to I/O enclosures (if C3 present)
   P1-C4-T1	PCIe to I/O enclosures (if C4 present)
   P1-C6-T1	PCIe to I/O enclosures
   P1-C8-T1	PCIe to I/O enclosures
   P1-C9-T1	PCIe to I/O enclosures
   P1-C10-T1, P1-C10-T2	Customer network (optional feature, if used)
   P1-C11-T1, P1-C11-T2	LPAR Ethernet
   P1-C12-T1	PCIe to I/O enclosures

   

6. Reconnect the power cords to the CEC enclosure. See Figure 35.
7. Fasten the power cords to the enclosure using the hook-and-loop fasteners .

   

8. Verify that the CEC enclosure has power available. See Figure 36.
   1. At the rear of the CEC enclosure, view the CEC enclosure power supply DC LEDs.
   2. Are all DC (output) LEDs flashing?
      • Yes, continue with the next step.
      • No, ensure the power cords are properly connected. If no connection problem is found, contact your next level of support.

   

9. Wait up to 5 minutes for the CEC enclosure control panel power button LED to flash. See Figure 37.
   Note: Waiting ensures that the CEC enclosure is in the power-off state.

   Is the power button LED flashing?

   • Yes, go to the next step.
   • No, ensure the CEC enclosure power supplies are fully seated. The possible failing FRUs are the CEC enclosure system backplane and control panel. You can also call the next level of support.

   

10. Close the rear door of the rack.
11. Exit this service information center parts exchange procedure and return to the procedure that sent you here.