Removing the system processor module in the 8348-21C system

Learn how to remove the system processor module from the IBM® Power® System S812LC (8348-21C) system.

1. Attach the electrostatic discharge (ESD) wrist strap.
   Attention:

   • Attach an electrostatic discharge (ESD) wrist strap to the front ESD jack, to the rear ESD jack, or to an unpainted metal surface of your hardware to prevent the electrostatic discharge from damaging your hardware.
   • When you use an ESD wrist strap, follow all electrical safety procedures. An ESD wrist strap is used for static control. It does not increase or decrease your risk of receiving electric shock when using or working on electrical equipment.
   • If you do not have an ESD wrist strap, just prior to removing the product from ESD packaging and installing or replacing hardware, touch an unpainted metal surface of the system for a minimum of 5 seconds.
2. Open the packaging of the new system processor module, and place the cover upside down next to the tray, as shown in Figure 1. The cover is used for the system processor module that you are replacing.
   Figure 1. Opening the system processor module packaging

   
3. Remove the processor baffle. See Removing the processor baffle from an 8348-21C system.
4. Remove the heat sink from the system processor module:
   1. A hex key wrench is attached to the rear of the chassis. Use that hex key wrench to loosen the heat sink actuation screw (A) by turning the screw counterclockwise. Loosen the screw until it moves freely. See Figure 2.
   2. Grip the heat sink (B) on opposing sides and remove the heat sink by lifting it upward. Set the heat sink aside with the module side facing up.
      Note: If you plan to remove dust or debris from the heat sink, you must do this operation in another room that is greater than 7.6 m (24.9 ft) away from the work area.
   Figure 2. Removing the heat sink

   
5. Remove dust and debris from the system processor module area.
   1. If dust or debris is present, use the supplied air pump (part number 45D2645) to clean the system processor module area. Blow small bursts of air from the center toward the sides of the system processor module as shown in Figure 3. If your air pump is not assembled as shown in Figure 3, fasten the tip onto the bulb.
      Figure 3. Removing dust and debris from the system processor module area

      
6. Prepare the system processor module for removal.
   1. Using the supplied removal tool (part number 01AF101), align the beveled corner (A) of the tool over the beveled corner of the system processor module as shown in Figure 4.
   2. Lower the tool over the system processor module by ensuring that the two guide pins (C) are inserted into the alignment holes (B) on each side of the tool.
      Figure 4. Lowering the removal tool onto the system processor module

      
   3. With the removal tool (A) sitting on top of the system processor module, push down on the tool to lock the system processor module into the tool, as shown in Figure 5. Ensure that both of the tool jaws are locked on the system processor module. Do not press the blue release tabs until directed to do so later.
      Note: The tool drops slightly when you push down on the processor module so that the jaws can grab the bottom of the module.
      Figure 5. Locking the system processor module into the tool

      
7. Holding the outside of the tool, lift the tool and system processor module from the socket. Place them at an angle in the top cover of the system processor module packaging, as shown in Figure 6.
   Note: Setting the tool and system processor module at an angle on the top cover of the system processor module packaging will make it easier to pick up and place in the packaging after you replace the system processor module.
   Figure 6. Placing the tool at an angle on the top cover of the packaging

   
8. Squeeze the two blue tabs to release the system processor module from the tool. See Figure 7.
   Note: To prevent the system processor module from falling, do not squeeze the two tabs before you place the tool on the top cover of the system processor module packaging.
   Figure 7. Releasing the system processor module from the tool