Replacing the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D system processor modules

Learn how to replace the system processor modules that is part of a service action.

1. Install the processor module:
   1. Fully depress and hold the vacuum pen button (A) and place it in the center of the processor module, then release the vacuum pen button. Releasing the button creates suction. Lift the processor module upward. See Figure 1.
      Figure 1. Removing the system processor modules from the packaging

      
   2. Inspect the bottom of the processor module for any visible damage or debris. If debris is present, you can use the air pump to remove it. See Figure 2.
      Note: Do not touch or use a brush on the processor module.
      Figure 2. Removing debris from the system processor modules

      
   3. Lower the system processor modules on to the board using the two keyed notches (A) on the processor module and two keyed corners (B) on the processor socket for alignment. Release the vacuum from the pen by pushing the button (C). See Figure 3.
      Figure 3. Installing the system processor modules

      
   4. Ensure that the processor module is fully seated by pressing firmly with finger.
2. Inspect the thermal interface material (TIM) for visible signs of damage. The expectation is that when the heat sink is removed from the failed processor module, the TIM is attached to the heat sink. Unless damaged, the TIM attached to the heat sink can be reused. See Figure 4.
   Figure 4. Inspecting the thermal interface material

   
   Note: Replacing the TIM is optional and is only performed when there is damage to the TIM. Do not reuse the removed heat sink with TIM if it has damage. Either discard the heat sink and damaged TIM locally or return to IBM based on part-order-form part status.
3. Replace the TIM and heat sink:
   1. If TIM or heat sink replacement is necessary, order part number 74Y7421, Heat sink and Indium (TIM).
   2. Remove the clear film from the thermal interface material packaging.
      Note: The TIM must remain flat. Small wrinkles are acceptable, but folds are not acceptable.
   3. Lightly grip the TIM by the edges and center it onto the processor module with the red stripe facing up. See Figure 5.
   Figure 5. Installing the TIM onto the processor lid

   
4. Install the heat sink:
   1. Position the heat sink using the guide holes on the heat sink (A) to correctly align it with the guide pins (B). See Figure 6.
   2. Ensure that the heat sink load arms are engaged.
      Note: If either of the plastic load arm latches is broken, you must manually engage the load arms onto the heat sink while the load screw is tightened.
      Figure 6. Installing the heat sink

      
   3. Tighten the center load screw (B) clockwise by using the supplied hex key until a firm stop is reached. If the heat sink moves noticeably, the load arms (A) are not engaged. Unscrew the center load screw and try this step again. See Figure 7.
      Figure 7. Tightening the center load screw on the heat sink

      
5. Replace the service access cover. For instructions, see Installing the service access cover on the 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D system.
6. Place the system in the operating position. For instructions, see Placing the rack-mounted 8231-E2B, 8231-E1C, 8231-E1D, 8231-E2C, 8231-E2D, or 8268-E1D system into the operating position.
7. Restore power to the system by reconnecting the system power cables.
8. Go to Verifying a repair.