- Will P.A. Semi's "25W SoC with Dual 2GHz Power Cores and Integrated Memory and I/O Subsystems" have a die size of just 115sqmm?
- Will the next 65nm Cell BE processor run at 6GHz (1.3V)?
- And, what are some new details about the mighty POWER6?
All this and ... wait! There's more. Like
The POWER6 microprocessor combines ultra-high frequency operation, aggressive power reduction, a highly scalable memory subsystem, and mainframe-like reliability, availability, and serviceability. The 341sqmm 700M transistor dual-core microprocessor is fabricated in a 65nm SOI process with 10 levels of low-k copper interconnect. It operates at clock frequencies over 5GHz in high-performance applications, and consumes under 100W in power-sensitive applications.
And there is also a PDF of IBM's Microprocessor Forum POWER6 roadmap presentation that features a first small picture of the die and contains information about the new system topology and advanced chip features. --ks