Speaking of the IBM Journal of Research and Development, the new issue has either been released, or is about to be released. I honestly can never tell with the IBM JoRD, because for the life of me, I can never find any date on said publication other than the year (accompanied by the volume number) on the front page
. Well, and then of course date information like Received December 4, 2004; accepted for publication January 26, 2005; Published online September 23, 2005.
at the bottom of individual articles (ha - and some of my authors think I
sometimes take a long time to turn things around!)
But seriously, folks. This new issue is again a double issue, this time devoted to POWER5 system architecture and advanced packaging for microelectronics. The articles touch on hot topics like virtualization (for the POWER5) and lead-free alloys (for the packaging) and the reason, of course, that the articles take so long to turn around is that they are actual, real, peer-reviewed journal articles -- always very good stuff.
And there is a bonus article on the Cell "multiprocessor" and its history
Returnto the Power Architecture zone