By Jenifer Hopper. On POWER7+ systems, a new processor chip packaging scheme has emerged which combines two processor chips into a single module, which in turn plugs into a single socket on the system. Along those lines, a new article on POWER7+ SCM and DCM Systems has been published.
IBM® recently announced new updates for the IBM Power 750 Express server and the IBM Power 760 server, both of which are now based on the newly introduced POWER7+™ processor packaged on a dual chip module (DCM).
Earlier POWER7® systems were based on a single chip module (SCM) packaging, and some of the new POWER7+ systems, like the IBM PowerLinux 7R2 server, continue to use the single chip modules.
In our Linux software performance team, we have been curious about the practical differences of this new processor packaging form.
This article describes our views of the POWER7+ dual chip module (DCM) package and how the DCM compares to the POWER7+ single chip module (SCM). The article focuses on what a Linux user can "see" from within the context of the Linux operating system.
Check out the latest technology article. It provides links to related materials and some basic out-of-the-box performance observations for the new technology. Additional articles are being worked which build on this baseline.