IBM Research had 21 papers accepted to SPIE, and throughout the four-day conference IBM researchers will present on topics ranging from EUV lithography, patterning materials, etch, selective deposition, and novel device integration.
This post originally appeared on EE Times I love my work in lithography and sharing my experiences with young people, hoping to inspire them when they realize the fun and art behind science. At a young age, I was very curious about how things worked. Much to the surprise and encouragement of my two parents […]
When we announced the industry’s first functional 7 nanometer node (7nm) test chips in 2015, with our GLOBALFOUNDRIES and Samsung partners, we knew the process for the chips to reach “manufacturing maturity” – perhaps as early as next year, would be rapid. As that effort accelerates in the semiconductor industry, IBM continues to push the […]
Dr. Griselda Bonilla is the senior manager of the Advanced BEOL Interconnect Technology team at IBM Research, responsible for delivering innovative solutions that advance IBM’s industry-leading, on-chip interconnect (BEOL) technologies. We sat down with her before her team gave two talks at the IITC/AMC Conference in San Jose, California this week. First off, tell us […]