Beat the heat in 3D chip stacks with ICECool

Editor’s note: This article is by Timothy Chainer, Pritish R. Parida, and Mark Schultz, IBM Research. In the Moore’s Law race to keep improving computer performance, the IT industry has turned upward, stacking chips like nano-sized 3D skyscrapers. But those stacks, like the law it’s challenging, have their limits, due to overheating. So, our team […]

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