Skip to main content

IBM announces its 2000 Environmental Affairs Excellence Award winners

IBM announces its 2000 Environmental Affairs Excellence Award winners

20 Jul 2000 -- IBM has announced its formal recognition of 39 employees for their contributions to IBM's leadership in environmental protection, energy conservation and product design for the environment. The achievements were acknowledged through IBM's Corporate Environmental Affairs Excellence Awards program.

Now in its tenth year, the program recognizes the contributions of individuals and teams of employees with awards up to $50,000 for innovative accomplishments that contribute to IBM's environmental, energy, and occupational health services objectives.

This year, seven awards totaling $230,000 are being presented to the following employees:

Scott Cummings, Jonathan Orth and Alfred Rouleau, III, of Burlington, Vermont, share $50,000 for the development of a unique new process for removing encrusted photoresist materials from wafer processing chambers in semiconductor manufacturing. A first in the industry, this new process uses glacial acetic acid instead of the more traditional organic solvents. The resultant environmental benefits include the elimination of 87,000 gallons of solvent use and its disposal, as well as the associated transportation of the wastes off-site. Further, the new process reduces the amount of chemical required for the chamber cleaning operation by 97 percent. The innovation, for which patents have been applied, also saves $300,000 per year in operational expenses.

James Elliott, Richard Gaylord, Donald J. Martin, Sheldon McNickle and Mark Pakulski of Burlington, Vermont, share $35,000 for developing a new process that replaced a static sulfuric-nitric mixture bath with an in-situ generated mixture of sulfuric-ozone used in two high volume wafer cleaning steps in the manufacture of semiconductors. On an annual basis, the new process eliminated 1,850 gallons of nitric acid use, decreased sulfuric acid use by 12,500 gallons, and reduced energy consumption by 108,500 kWhr and the associated 13 tons of carbon dioxide emissions. The achievement reduces chemical handling and decreases the discharge of nitrates and acid emissions to the environment while saving IBM $135,000 per year.

John Butler, Robert Magee, Tim Makara, Mary Mayotte, Krishna Sachdev, John Simon, David Speed, Ron Shipley, Salvatore Tranchina and Bruce Tripp of East Fishkill, New York, share $35,000 for a significant pollution prevention achievement in the manufacture of multilayer ceramic substrates. The team developed, qualified and implemented a new aqueous based cleaning process, decreased hazardous waste generation by more than 100 tons per year, and installed new state-of-art air abatement technology which reduced air emissions. Three patents have been granted to the new process.

Takuji Satoh of Fujisawa, Japan, and Seita Horikoshi and Tetsuya Ohtani of Yamato, Japan, share $35,000 for reducing the packaging used to ship IBM ThinkPads worldwide. To achieve this leadership initiative, the team developed a new mounting method for the hard drive in the ThinkPad to further enhance its inherent ruggedness. This advancement made possible the replacement of plastic foam shipping material with environmentally preferable recyclable paper packaging. This eliminated 45 percent of the packaging by weight per product, decreased the package size by 50 percent, and reduced the disposal of plastic foam packaging. The accomplishment is saving IBM $873,000 per year in packaging material and $539,000 per year in transportation costs as a result of reduced package size.

Ash Bhatt, Gerald W. Jones, John Konrad, Joseph Kotylo, Amarjit Rai, Gary Vlasak and Jerome Wagner of Endicott, New York, share $25,000 for the implementation of a selective gold plating process using advanced solder mask in the manufacture of high-end printed wiring boards. By selectively plating only desired areas of a board, this new process avoids the use of 75,000 square feet of photoresist and reduces waste disposal by 10,500 gallons per year. In addition, the new plating method simplified the manufacturing process, shortening cycle time, reducing defect levels, and resulting in an annual manufacturing cost savings of $2.65 million.

Jimmy Blaylock, Chuck Dabney, Lee Davis, O.D. Ellis, Garry Garver, and Kenny Slater of Research Triangle Park, North Carolina, shared $25,000 for the implementation of the first performance contract between IBM and a company specialized in energy management. This performance contract enabled sitewide energy infrastructure upgrades including heating, ventilation, and air conditioning improvements and an upgrade of a cooling tower and flat plate heat exchanger for winter free cooling. The contract results in an annual energy conservation savings of 9.3 million kWhr and operating cost savings of $1.3 million.

Kaoru Furuta, Katsumi Inden, Kazuyuki Nakahara, Tatsuroh Odagiri, and Hiroyuki Ueda of Yasu, Japan, share $25,000 for the development of a new etching process in Thin-Film Transistor-Liquid Crystal Display manufacturing. The new etching process involved the use of an improved thin film which can be processed with oxalic acid, a weak organic acid. It eliminated the annual use of 132,000 liters and 62,000 liters of hydrochloric acid and nitric acid, respectively. In addition, the number of etching steps were reduced from seven to five, causing a 37 percent reduction in the use of etching gases tetrafluoromethane and sulfur hexafluoride, both with high global warming potential. Finally, this accomplishment resulted in increased production capacity by 13 percent while avoiding $30 million in equipment upgrades. A patent application has been filed for this technology.