IBM System z9 Business Class

• Transparent CP Sparing



• Fault Tolerant Interconnect Design



• Dynamic memory sparing



• CICS® subspace group facility



• Enhanced Firmware Simulation



• Remote operations support



• N+1 power supply technology



• Concurrent channel, OSA-E, OSA-E2 and Coupling Link maintenance



• Dynamic I/O Reconfiguration



• FICON® Purge Path Extended



• System Assist Processor (SAP)



• Sparing for Storage Protect Preservation Keys



• Partial memory restart



• CICS subsystem storage protect



• Dual Support Elements



• Air cooling



• Concurrent Hardware Management Console (HMC) and Support Element



• Redundant I/O Interconnect



• Enhanced Driver Maintenance



• Failure Containment for MBA



• Reassignment and Sparing



• Dynamic Channel Path Management



• Concurrent power and thermal maintenance



• Concurrent Licensed Internal Code (LIC) maintenance for CP, SAP, SE, PR/SM™, LPAR, HMC, OSA-Express2



• Enhanced Dynamic Reconfiguration Management

• Open Architecture Distributed Transaction Enablement



• Advanced encryption standard (AES)



• Pseudo random number generator (PRNG)



• Secure hash algorithm-256 (SHA-256)



• CP Assist for Cryptographic Function



• SSL Acceleration for Linux and z/OS



• Certified for LPAR isolation



• Designed for EAL5 certification



• Tamper-proof Cryptographic Support



• Designed for FIPS 140-2 Level 4



• Configurable Crypto Express2 (secure coprocessor or SSL acceleration)



• Remote key load for ATMs

• Capacity Upgrade on Demand



• On/Off Capacity on Demand (On/Off CoD)



• Customer Initiated Upgrades



• Capacity BackUp



• Administrative On/Off CoD Testing



• API for On/Off CoD activation

• Internal Coupling Facility (ICF)



• System z9 Integrated Information Processor (zIIP)



• Integrated Facility for Linux (IFL)



• System z Application Assist Processor (zAAP)

• FICON Express4 4 Gbps



• FICON full duplex data transfer



• N_Port ID Virtualization



• Multiple Image Facility (MIF) sharing across LCSSs



• FICON CTC



• Full fabric FCP support



• FCP support for SCSI devices by Linux and z/VM



• ESCON® half duplex data transfer



• ESCON CTC native and basic mode



• Logical Channel SubSystems

• OSA-Express (Gigabit Ethernet, 1000BASE-T Ethernet, Fast Ethernet)2



• HiperSockets™



• OSA-Express2 (Gigabit Ethernet, 10 Gigabit Ethernet, 1000BASE-T Ethernet)



• OSA-Express Integrated Console Controller (1000BASE-T Ethernet)



• OSA-Express and OSA-Express2 Layer 2 Support



• OSA or NCP (OSN)

• Parallel Sysplex® clustering technology



• Internal Coupling Facility (ICF)



• Internal Coupling Channel



• InterSystem Channel-3 (Peer mode only)



• Sysplex Distributor



• Geographically Dispersed Parallel Sysplex™



• Transparent ICF Sparing



• Integrated Cluster Bus-3



• Integrated Cluster Bus-4



• CF Duplexing



• Shared ICFs and CPs



• Dynamic CF Dispatching



• Dynamic ICF Expansion



• z/VM Virtual Parallel Sysplex



• System-Managed Coupling Facility Duplexing

• IEEE binary floating point support for advanced Lotus® Domino™ and Java™ performance



• Multiple Subchannel Sets (MSS)



• Modified Indirect Data Address Word (MIDAW) Facility



• Up to 64GB memory



• Hiperbatch™



• Long Displacement Facility



• Hardware-assisted data compression



• Hipersorting



• Compare-and-move extended



• DB2® sort assist



• Performed Locked Operations for enhanced IP performance

• (SE) maintenance



• Internal Battery Feature



• Power/thermal



• ESCON sparing



• Cancel I/O Requests

• Intelligent Resource Director



• Up to 30 LPARS each (up to 15 LPARS each for Model R07) with 64-bit central memory addressability



• Tri-modal addressability



• Superscalar Processor